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2UUL DA07 Mini Hot Press Station for Phone Frame/Back Cover Repair BGA Reballing Stencil JC P13 PCIE BGA110 Nand

SKU 22631810272
USD41.59 USD64.59
4.3

Pay in 4 interest-free payments of $10.40 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Oct 17 - Oct 22

Pit notes

Duotone bay — asphalt brief on the left, yellow-folded service sheet on the right.

Service sheet
Description

2UUL DA07 Mini Hot Press Station for Phone Frame Back Cover Repair BGA Reballing Stencil JC P13 PCIE BGA110 Nand JC P13 PCIE BGA110 Nand reading writing WIFI unbinding function for iPhone 8 13 Pro Max Exynos 8895

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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